| Products | Physical Property | Features & Uses | |||||
|---|---|---|---|---|---|---|---|
| Solid Content (wt %) | Specific Gravity (20℃) | Viscosity (20℃)(cP) | Chlorine Content (%) | ||||
| Resing Type | General Use | PO-F-1010S | 15 | 0.823 | 4.5 | 0.07 | Chip mounted & high density boards, standard type. |
| PO-F-1010K | 17 | 0.825 | 4.1 | 0.07 | Prevention of dew condensation. | ||
| ES-1061SP-2 | 15 | 0.826 | 4.0 | 0.09 | Pb-free soldering. | ||
| Lower Residue | PO-F-009M | 9 | 0.807 | 3.2 | 0.06 | Chip mounted & high density boards, lower residue, spray coating. | |
| PO-F-710 | 12 | 0.820 | 3 | 0.06 | Chip mounted & high density boards, spray coating, lower residue. | ||
| RMA | SR-209 | 12 | 0.820 | 3.7 | *RMA | Lower residue, non-cleaning, lusterless type. | |
| SR-12 | 12 | 0.818 | 3.6 | *RMA | Lower residue, non-cleaning. lustrous type. | ||
| Water-Soluble Type | General Use | WF-2050 | 20 | 0.887 | 6.7 | 2.00 | High density electronic boards. |
| Preliminary soldering of parts | WF-3041 | 46 | 1.156 | 6.1 | 0.000 | Soldering of nickel & copper based alloys, halogen-free. | |
| Tinning Flux | T-a | 1 | 0.829 | 3.0 | 0.16 | Tinning for lead wire, negligible residues. | |
* The procedure is similar to chlorides and bromides test.
千住 es-1061sp-2 ・・・ 無洗浄対応. 窒素ガス純度99.99%(o 2 ＜100ppm) 窒素ガス発生量30.0nm 3 /h. 1．） JIS 2型の櫛形基板全面に千住金属工業製のポストフラックスES-1061SP-2を浸漬塗布する。 2．） Sn-3Ag-0.5Cu組成のはんだ合金を入れたはんだバスを260℃に加熱しておく。. Products Solid content Chroline content Specific gravity (20°C) Remarks; ES-1061SP-2: 15%: 0.09%: 0.826: Prevents bridging of ES-1061, good finish in through-hole.
スパークルフラックス Es-1061sp-2
Es 1061sp 200
There are many types of flux, depending on the required application and performance. We supply a wide choice of fluxes including the resin type and water soluble type to meet every needs.
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